Senior Engineer, Process Integration, NAND, NTI

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.Your responsibilities will include, but are not limited to, the following:Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturabilityDevelop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capabilityCoordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partnersUndertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facilityTake on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teamsAssist in the transfer of new technology from R&D to manufacturingContribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturingArtificial IntelligenceUsing, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.Successful candidates for this position,Must have:Passion in semiconductor technology and innovationAdept at data analysis, problem-solving, and process integration optimizationExcellent communication skills and ability to work in cross-functional teamsCommitted to quality, collaboration, and continuous improvementAbility to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environmentAbility to travel for extended periods to the US for collaborative R&D workRequirements:BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related fieldProficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield EnhancementAbility to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanismsIn-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirableExposure to R&D (such as HKMG) and transfer/manufacturing is desirable